Aries Electronics, Inc. 22-4508-21

22-4508-21 picture photo
Mfg. Part Number
22-4508-21
Manufacturer
Product Category
Sockets for ICs, Transistors
Brief Description
CONN IC DIP SOCKET 22POS GOLD
Datasheet Download
22-4508-21.pdf
Availability of 22-4508-21

Available Quantity

5020 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 15.79600
Our Price
Quote by Email

QUANTITY

 

EIS Components is the stocking Distributor of 22-4508-21, we specialize in Aries Electronics, Inc. all series electronic components. 22-4508-21 can be shipped within 24 hours after order. If you have any demands for 22-4508-21, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
22-4508-21 Order Process
Add Parts to RFQ form
Submit RFQ
We reply within 24 hours
You confirm order
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Specifications of 22-4508-21
Internal Part NumberEIS-22-4508-21
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Standard Package1
Category Connectors, Interconnects
FamilySockets for ICs, Transistors
Series508
PackagingBulk
TypeDIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid)22 (2 x 11)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationWire Wrap
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 125°C
Termination Post Length0.360" (9.14mm)
Material Flammability RatingUL94 V-0
Current Rating3A
Contact Resistance-
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)22-4508-21
Related Links22-45, 22-4508-21 Datasheet, Aries Electronics, Inc. Distributor
22-4508-21 Details Description
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