Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-2306 321 55627 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 200 | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Series | AC05 | |
| Packaging | Bulk | |
| Resistance (Ohms) | 0.62 | |
| Tolerance | ±5% | |
| Power (Watts) | 5W | |
| Composition | Wirewound | |
| Features | Flame Retardant Coating, Pulse Withstanding, Safety | |
| Temperature Coefficient | 0/ +600ppm/°C | |
| Operating Temperature | -40°C ~ 200°C | |
| Package / Case | SMD Z-Bend Axial | |
| Supplier Device Package | SMD | |
| Size / Dimension | 0.295" Dia x 0.669" L (7.50mm x 17.00mm) | |
| Height | - | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 2306 321 55627 | |
| Related Links | 2306 32, 2306 321 55627 Datasheet, Vishay/Phoenix Passive Components Distributor | |
![]() | CRCW25122M74FKEG | RES SMD 2.74M OHM 1% 1W 2512 | datasheet.pdf | |
![]() | RG1005P-5230-D-T10 | RES SMD 523 OHM 0.5% 1/16W 0402 | datasheet.pdf | |
![]() | RMCF0402FT30R9 | RES SMD 30.9 OHM 1% 1/16W 0402 | datasheet.pdf | |
![]() | IXGP42N30C3 | IGBT 300V 223W TO220AB | datasheet.pdf | |
![]() | 0761456103 | IMPACT BP 6X10 GL/W SN/PB | datasheet.pdf | |
![]() | VE-B6N-MU-F4 | CONVERTER MOD DC/DC 18.5V 200W | datasheet.pdf | |
![]() | 0399810303 | TERM BLOCK PLUG 3POS 5.08MM | datasheet.pdf | |
![]() | 5SGXEB5R1F43C2N | IC FPGA 600 I/O 1760FBGA | datasheet.pdf | |
![]() | HW23508300J0G | 508 TB SPR PLU WF UP | datasheet.pdf | |
| SI5348A-B-GMR | IC CLOCK GEN TO 712.5MHZ 64QFN | datasheet.pdf | ||
![]() | CY15B128J-SXA | F-RAM MEMORY SERIAL | datasheet.pdf | |
![]() | XC4VLX100-11FF1513I0968 | XILINX IC XC4VLX100-11FF1513I0968 In stock | datasheet.pdf |