Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-25LC010AT-E/MNY | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Mold Compound Update 18/Feb/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| PCN Other | CuPdAu Bond Wire 24/Apr/2015 | |
| Standard Package | 3,300 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | EEPROMs - Serial | |
| Memory Type | EEPROM | |
| Memory Size | 1K (128 x 8) | |
| Speed | 10MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 2.5 V ~ 5.5 V | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 8-WFDFN Exposed Pad | |
| Supplier Device Package | 8-TDFN (2x3) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 25LC010AT-E/MNY | |
| Related Links | 25LC010, 25LC010AT-E/MNY Datasheet, Microchip Technology Distributor | |
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