Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-272-AB | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,250 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Heat Sinks | |
| Series | 272 | |
| Type | Board Level | |
| Package Cooled | TO-220, TO-202 | |
| Attachment Method | Bolt On and PC Pin | |
| Shape | Rectangular, Fins | |
| Length | 1.450" (36.83mm) | |
| Width | 1.750" (44.45mm) | |
| Diameter | - | |
| Height Off Base (Height of Fin) | 0.375" (9.52mm) | |
| Power Dissipation @ Temperature Rise | 4W @ 42°C | |
| Thermal Resistance @ Forced Air Flow | 3.6°C/W @ 400 LFM | |
| Thermal Resistance @ Natural | 10.5°C/W | |
| Material | Aluminum | |
| Material Finish | Black Anodized | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 272-AB | |
| Related Links | 272, 272-AB Datasheet, Wakefield Distributor | |
![]() | 81100000005 | FUSE HOLDER CART 250V 6.3A PCB | datasheet.pdf | |
![]() | MCP608-I/P | IC OPAMP GP 155KHZ RRO 8DIP | datasheet.pdf | |
![]() | CSC04A011M00GPA | RES ARRAY 3 RES 1M OHM 4SIP | datasheet.pdf | |
![]() | 71V3556SA100BQ | IC SRAM 4.5MBIT 100MHZ 165CABGA | datasheet.pdf | |
![]() | PE-0805CD150JTT | FIXED IND 14.9NH 600MA 170 MOHM | datasheet.pdf | |
![]() | ASY-MDEV-GPS-SG-DB | MASTER DEV SYST SG DAUGHTER BRD | datasheet.pdf | |
![]() | LD6806F/33P,115 | IC REG LDO 3.3V 0.2A 6XSON | datasheet.pdf | |
![]() | LM2588S-3.3 | IC REG MULT CONFIG 3.3V 5A TO263 | datasheet.pdf | |
![]() | MI-27N-IY-F1 | CONVRT DC/DC 165VIN 18.5VOUT 50W | datasheet.pdf | |
![]() | C8051F526-C-IM | IC MCU 8051 2KB FLASH 10DFN | datasheet.pdf | |
![]() | ATS-11E-55-C2-R0 | HEATSINK 35X35X10MM L-TAB T766 | datasheet.pdf | |
![]() | GRM1555C2A9R7DA01D | CAP CER 9.7PF 100V NP0 0402 | datasheet.pdf |