Aries Electronics, Inc. 28-3551-18
- Mfg. Part Number
- 28-3551-18
- Manufacturer
- Aries Electronics, Inc.
- Product Category
- Sockets for ICs, Transistors
- Brief Description
- CONN IC DIP SOCKET ZIF 28POS
- Datasheet Download
- 28-3551-18.pdf
Availability of 28-3551-18
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 63.69907
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of 28-3551-18, we specialize in Aries Electronics, Inc. all series electronic components. 28-3551-18 can be shipped within 24 hours after order. If you have any demands for 28-3551-18, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- 28-3551-18 Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
28-3551-18
| Internal Part Number | EIS-28-3551-18 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 9 | |
| Category | Connectors, Interconnects | |
| Family | Sockets for ICs, Transistors | |
| Series | 55 | |
| Packaging | Bulk | |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | |
| Number of Positions or Pins (Grid) | 28 (2 x 14) | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Nickel Boron | |
| Contact Finish Thickness - Mating | 50µin (1.27µm) | |
| Contact Material - Mating | Beryllium Nickel | |
| Mounting Type | Through Hole | |
| Features | Closed Frame | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Nickel Boron | |
| Contact Finish Thickness - Post | 50µin (1.27µm) | |
| Contact Material - Post | Beryllium Nickel | |
| Housing Material | Polyetheretherketone (PEEK), Glass Filled | |
| Operating Temperature | -55°C ~ 250°C | |
| Termination Post Length | 0.110" (2.78mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | 1A | |
| Contact Resistance | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 28-3551-18 | |
| Related Links | 28-35, 28-3551-18 Datasheet, Aries Electronics, Inc. Distributor | |
28-3551-18 Details Description
Related parts for 28-3551-18
.jpg) | Z85C3008VSG | IC 8MHZ Z8500 CMOS SCC 44-PLCC | datasheet.pdf | |
| 185C20 | XFRMR LAMINATED 25VA CHAS MOUNT | datasheet.pdf | |
| GSM43DSEN-S13 | CONN EDGECARD 86POS .156 EXTEND | datasheet.pdf | |
 | 3404.0117.11 | FUSE BRD MNT 2.5A 125VAC/VDC SMD | datasheet.pdf | |
| 7-1879526-2 | RES SMD 68.1K OHM 1% 2W 2512 | datasheet.pdf | |
| RN60D2212FRSL | RES 22.1K OHM 1/4W 1% AXIAL | datasheet.pdf | |
| CA08COME22-22S | CONN PLUG 4POS RT ANG W/SKTS | datasheet.pdf | |
| EMVY350ADA470MHA0G | CAP ALUM 47UF 20% 35V SMD | datasheet.pdf | |
| 853-87-032-20-001101 | Connector Socket 32 Position 0.050" (1.27mm) Gold Through Hole, Right Angle | datasheet.pdf | |
 | R5F104CFALA#U0 | IC MCU 16BIT 96KB FLASH 36LGA | datasheet.pdf | |
| HM18708000J0G | 500 TB SP CLA DIP SOLDER | datasheet.pdf | |
| SG3102E32-8P | ER 30C 24#16 6#12 PIN RECP BOX | datasheet.pdf |