Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-51-322-009 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 50 | |
| Category | Filters | |
| Family | EMI/RFI Filters (LC, RC Networks) | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 51-322-009 | |
| Related Links | 51-32, 51-322-009 Datasheet, API Technologies Corp Distributor | |
![]() | ERJ-12ZYJ754U | RES SMD 750K OHM 5% 3/4W 2010 | datasheet.pdf | |
![]() | MIC284-0BM-TR | SENSOR TEMP I2C/SMBUS 8SOIC | datasheet.pdf | |
![]() | GBB30DHNR | CONN EDGECARD 60POS .050 DIP SLD | datasheet.pdf | |
![]() | 25LC640AT-I/MNY | IC EEPROM 64KBIT 10MHZ 8TDFN | datasheet.pdf | |
![]() | PA2080.191NL | FIXED IND 185NH 40A 0.49 MOHM TH | datasheet.pdf | |
![]() | RCL061275R0JNEA | RES SMD 75 OHM 1/2W 1206 WIDE | datasheet.pdf | |
| TH3D226M035C0600 | CAP TANT 22UF 35V 20% 2917 | datasheet.pdf | ||
![]() | 5AGXBB3D6F35C6N | IC FPGA 544 I/O 1152FBGA | datasheet.pdf | |
![]() | ATS-10B-77-C1-R0 | HEATSINK 25X25X30MM R-TAB | datasheet.pdf | |
![]() | L77SDDG50SOL2RM8C309 | D-Sub Connector Receptacle, Female Sockets 50 Position Through Hole Solder | datasheet.pdf | |
![]() | FX20-140P-0.5SV20(10) | CONN HDR 140POS 0.5MM SMD | datasheet.pdf | |
![]() | 0936012659 | HOOD TOP ENTRY 4PEGS HIGH CONSTR | datasheet.pdf |