Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A15323-02 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Tflex™ 300 | |
| Usage | Sheet | |
| Shape | Square | |
| Outline | 457.20mm x 457.20mm | |
| Thickness | 0.030" (0.762mm) | |
| Material | Silicone Elastomer | |
| Adhesive | - | |
| Backing, Carrier | - | |
| Color | Green | |
| Thermal Resistivity | 2.11°C/W | |
| Thermal Conductivity | 1.2 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A15323-02 | |
| Related Links | A153, A15323-02 Datasheet, Laird Technologies - Engineered Thermal Solutions Distributor | |
![]() | 151-10-314-00-010000 | HEADER OPEN .018"DIA .300 14POS | datasheet.pdf | |
![]() | RCC19DRAN-S734 | CONN EDGECARD 38POS .100 R/A PCB | datasheet.pdf | |
![]() | MC74HC573ADWG | IC TRANSP LATCH OCT 3ST 20-SOIC | datasheet.pdf | |
![]() | LM3S6422-IBZ25-A2T | IC MCU 32BIT 96KB FLASH 108BGA | datasheet.pdf | |
![]() | SAK-XC164CS-32F20F BB-A | IC MCU 16BIT 256KB FLASH 100TQFP | datasheet.pdf | |
![]() | OSTVQ081150 | TERM BLOCK RISING CLAMP 8POS | datasheet.pdf | |
![]() | S82S-7728 | PWR SUPPLY 7.5W 15/-15V 0.2A | datasheet.pdf | |
![]() | 04-7800-10 | CONN SOCKET SIP 4POS TIN | datasheet.pdf | |
![]() | ATS-11D-176-C2-R0 | HEATSINK 35X35X15MM R-TAB T766 | datasheet.pdf | |
![]() | DC1710A-A | EVAL BOARD FOR LTC5590 | datasheet.pdf | |
![]() | LTC6268HS8#TRPBF | IC OPAMP 500MHZ SGL FET 8SOIC | datasheet.pdf | |
![]() | 2M803-001-06NF12-220PN | M803 20C 20#20HD PIN PLUG OM | datasheet.pdf |