Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A2F500M3G-FGG256M | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Series | SmartFusion® | |
| Packaging | Tray | |
| Architecture | MCU, FPGA | |
| Core Processor | ARM® Cortex®-M3 | |
| MCU Flash | 512KB | |
| MCU RAM | 64KB | |
| Peripherals | DMA, POR, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART | |
| Speed | 80MHz | |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | |
| Operating Temperature | -55°C ~ 125°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FBGA (17x17) | |
| Number of I/O | MCU - 25, FPGA - 66 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A2F500M3G-FGG256M | |
| Related Links | A2F500M3, A2F500M3G-FGG256M Datasheet, Microsemi SoC Distributor | |
![]() | ECJ-1VF1H473Z | CAP CER 0.047UF 50V Y5V 0603 | datasheet.pdf | |
![]() | ATMEGA64-16AI | IC MCU 8BIT 64KB FLASH 64TQFP | datasheet.pdf | |
![]() | RNF14GTD240K | RES 240K OHM 1/4W 2% AXIAL | datasheet.pdf | |
![]() | 132125 | CONN SMA PLUG STR 50 OHM SOLDER | datasheet.pdf | |
![]() | VE-B74-EW-B1 | CONVERTER MOD DC/DC 48V 100W | datasheet.pdf | |
| 200PK100MEFC12.5X25 | CAP ALUM 100UF 20% 200V RADIAL | datasheet.pdf | ||
![]() | ZA028MACM1 | BUZZ PIEZO CIRC 30.70MM PANEL | datasheet.pdf | |
![]() | 640049-1 | POSITIONER | datasheet.pdf | |
![]() | IUG111-1-62-5.00-Q-01 | CIR BRKR MAG-HYDR LEVER 5A | datasheet.pdf | |
![]() | PA2398NLT | XFMR AC FORWARD 60W EFD20 | datasheet.pdf | |
![]() | TLE49644MXTMA1 | IC HALL EFFECT UNIPOLAR SOT23-3 | datasheet.pdf | |
![]() | EC0426-000 | MARKERS | datasheet.pdf |