Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A2F500M3G-FGG256M | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Series | SmartFusion® | |
| Packaging | Tray | |
| Architecture | MCU, FPGA | |
| Core Processor | ARM® Cortex®-M3 | |
| MCU Flash | 512KB | |
| MCU RAM | 64KB | |
| Peripherals | DMA, POR, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART | |
| Speed | 80MHz | |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | |
| Operating Temperature | -55°C ~ 125°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FBGA (17x17) | |
| Number of I/O | MCU - 25, FPGA - 66 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A2F500M3G-FGG256M | |
| Related Links | A2F500M3, A2F500M3G-FGG256M Datasheet, Microsemi SoC Distributor | |
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