Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P600-1FG484 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Gold to Palladium Coated Copper Wire Chg 5/Nov/2015 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 110592 | |
| Number of I/O | 235 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P600-1FG484 | |
| Related Links | A3P600, A3P600-1FG484 Datasheet, Microsemi SoC Distributor | |
![]() | XADRP-36V | CONN HOUSING XAD 36POS DL 2.5MM | datasheet.pdf | |
![]() | RMCF0603FG90K9 | RES SMD 90.9K OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | MMF25SBRD2K7 | RES SMD 2.7K OHM 0.1% 1/4W MELF | datasheet.pdf | |
![]() | VI-B2Z-CY-F2 | CONVERTER MOD DC/DC 2V 20W | datasheet.pdf | |
![]() | M39003/01-8046/TR | CAP TANT 2.7UF 10% 15V AXIAL | datasheet.pdf | |
![]() | 1978470000 | SC-SMT3.81/11/135LF 1.5 BK BX | datasheet.pdf | |
![]() | ER1641-222JP | FIXED IND 2.2UH 650MA 190 MOHM | datasheet.pdf | |
![]() | TA305PA39K0J | RES 39K OHM 5W 5% RADIAL | datasheet.pdf | |
![]() | 20020003-H241B01LF | TERM BLOCK | datasheet.pdf | |
![]() | KLKR001.TS | FUSE F/A CLASS CC 1A 600V | datasheet.pdf | |
![]() | D38999/24MD5PE-LC | CONN HSG RCPT JAM NUT 5POS PIN | datasheet.pdf | |
![]() | TVP00RW-13-8JE | TV 8C 8#20 SKT RECP | datasheet.pdf |