Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P600L-1FG484 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Gold to Palladium Coated Copper Wire Chg 5/Nov/2015 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3L | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 110592 | |
| Number of I/O | 235 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.14V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P600L-1FG484 | |
| Related Links | A3P600L, A3P600L-1FG484 Datasheet, Microsemi SoC Distributor | |
![]() | MDL-3/4-R | FUSE GLASS 750MA 250VAC 3AB 3AG | datasheet.pdf | |
![]() | TPA3111D1EVM | EVAL MODULE FOR TPA3111D1 | datasheet.pdf | |
![]() | PFS35-0R39F1 | RES SMD 0.39 OHM 1% 35W TO263 | datasheet.pdf | |
![]() | RCL12183R30FKEK | RES SMD 3.3 OHM 1W 1812 WIDE | datasheet.pdf | |
![]() | 0151680287 | FFC 1.25 TYPE A 22 CKTS LGT 152 | datasheet.pdf | |
![]() | 7427801 | FERRITE CORE FLAT 11.4MM | datasheet.pdf | |
![]() | P16OAS11HREDBLU | SWITCH PUSHBUTTON SPDT 8A 125V | datasheet.pdf | |
![]() | 3EZ17D/TR8 | DIODE ZENER 17V 3W DO204AL | datasheet.pdf | |
![]() | 1704398 | HEADER | datasheet.pdf | |
![]() | 10-350613-16P | CONN PLUG W/PINS | datasheet.pdf | |
![]() | H511A05100J0G | 750 TB SPR PLU F/SCREW | datasheet.pdf | |
![]() | EC1607-000 | MARKERS | datasheet.pdf |