Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AD9674EBZ | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation and Demonstration Boards and Kits | |
| Series | - | |
| Main Purpose | Interface, Analog Front End (AFE) | |
| Embedded | - | |
| Utilized IC / Part | AD9674 | |
| Primary Attributes | 8-Channel (Octal) | |
| Secondary Attributes | - | |
| Supplied Contents | Board | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AD9674EBZ | |
| Related Links | AD96, AD9674EBZ Datasheet, Analog Distributor | |
![]() | RG3216V-1052-C-T5 | RES SMD 10.5KOHM 0.25% 1/4W 1206 | datasheet.pdf | |
![]() | ABM11DRTF-S13 | CONN EDGECARD EXTEND 22POS .156 | datasheet.pdf | |
![]() | 12061C222MAT2A | CAP CER 2200PF 100V X7R 1206 | datasheet.pdf | |
![]() | W7CF004G1XAI-H41PD-04D.A5 | MEMORY CARD COMPACTFLASH 4GB SLC | datasheet.pdf | |
![]() | 3100U00451586 | HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | 1647776 | HEAVYCON PROTECT COVER TYPE B24 | datasheet.pdf | |
![]() | 18159 | STANDOFF KIT .420 M-F 6 PCS | datasheet.pdf | |
![]() | 5SGXMB6R2F43I2LN | IC FPGA 600 I/O 1760FBGA | datasheet.pdf | |
![]() | 4100-900 | EMI FILTER KIT PI TYPE | datasheet.pdf | |
![]() | ERJ-P6WF1300V | RES SMD 130 OHM 1% 1/2W 0805 | datasheet.pdf | |
![]() | MBB02070C1134FC100 | RES 1.13M OHM 0.6W 1% AXIAL | datasheet.pdf | |
![]() | 97-3107B20-19SX-940 | AB 3C 3#8 SKT PLUG | datasheet.pdf |