Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AFD58-20-16PX-6117 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors | |
| Series | MIL-C-26482 G Series II, AFD | |
| Packaging | Bulk | |
| Connector Type | Receptacle, Male Pins | |
| Number of Positions | 16 | |
| Shell Size - Insert | 20-16 | |
| Shell Size, MIL | - | |
| Mounting Type | Panel Mount, Flange | |
| Termination | Crimp | |
| Fastening Type | Bayonet Lock | |
| Orientation | X | |
| Ingress Protection | Environment Resistant | |
| Shell Material, Finish | Aluminum, Olive Drab Cadmium Plated | |
| Contact Finish | Gold | |
| Features | - | |
| Contact Finish Thickness | - | |
| Current Rating | 13A | |
| Voltage - Rated | - | |
| Operating Temperature | -55°C ~ 200°C | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AFD58-20-16PX-6117 | |
| Related Links | AFD58-20-, AFD58-20-16PX-6117 Datasheet, TE Connectivity Deutsch Connectors Distributor | |
![]() | 77081102 | RES ARRAY 7 RES 1K OHM 8SIP | datasheet.pdf | |
![]() | A22L-TY-24-01M | SWITCH PUSH SPST-NC 10A 110V | datasheet.pdf | |
![]() | LM3S9792-IQC80-C3 | IC MCU 32BIT 128KB FLASH 100LQFP | datasheet.pdf | |
![]() | OSTV7157151 | TERM BLOCK HDR 15POS R/A 5MM | datasheet.pdf | |
![]() | ECQ-E1825JFB | CAP FILM 8.2UF 5% 100VDC RADIAL | datasheet.pdf | |
![]() | EEU-HD1E470B | CAP ALUM 47UF 20% 25V RADIAL | datasheet.pdf | |
![]() | VI-26W-IX-F2 | CONVERTER MOD DC/DC 5.5V 75W | datasheet.pdf | |
![]() | VI-B6D-CY-F3 | CONVERTER MOD DC/DC 85V 50W | datasheet.pdf | |
![]() | MS3475W16-26PZ-LC | CONN HSG PLUG INLINE 26POS PIN | datasheet.pdf | |
![]() | D4N-1D72 | D4N-1D72 | datasheet.pdf | |
![]() | EP7311-IR-C | HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf | |
![]() | LDB312G4005C-300 | Chip Multilayer Hybrid Baluns | datasheet.pdf |