Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-AFS250-QNG180I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | Multiple Devices 15/Oct/2013 | |
PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
Standard Package | 184 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Fusion® | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | - | |
Total RAM Bits | 36864 | |
Number of I/O | 65 | |
Number of Gates | 250000 | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 180-WFQFN Dual Rows, Exposed Pad | |
Supplier Device Package | 180-QFN (10x10) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | AFS250-QNG180I | |
Related Links | AFS250-, AFS250-QNG180I Datasheet, Microsemi SoC Distributor |
RG1005V-3010-P-T1 | RES SMD 301 OHM 0.02% 1/16W 0402 | datasheet.pdf | ||
1770737 | TERM BLOCK HDR 4POS R/A 5.08MM | datasheet.pdf | ||
0752352787 | CONN HEADER BACKPLANE 56POS GOLD | datasheet.pdf | ||
TPS53317EVM-750 | EVAL MODULE FOR TPS53317-750 | datasheet.pdf | ||
RWR89S6R34FSB12 | RES 6.34 OHM 3W 1% WW AXIAL | datasheet.pdf | ||
MI-26J-MY | CONVERT DC/DC 270VIN 36VOUT 50W | datasheet.pdf | ||
CDSOD323-T24LC | TVS DIODE 24VWM 56VC SMD | datasheet.pdf | ||
SFH608-3X007T | OPTOISO 5.3KV TRANS W/BASE 6SMD | datasheet.pdf | ||
ATS-01H-51-C2-R0 | HEATSINK 30X30X20MM L-TAB T766 | datasheet.pdf | ||
4310H-101-224LF | RES ARRAY 9 RES 220K OHM 10SIP | datasheet.pdf | ||
SIT8008AIR7-33E | OSC MEMS PROG 2.0X1.6MM 3.3V | datasheet.pdf | ||
4-1195191-9 | SHIELD TERMINATOR | datasheet.pdf |