Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AT89LP216-20PU | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | MCU Product Line Introduction Software Framework (ASF) Example of Use Studio Introduction to Software Framework (ASF) Studio Development Environment Overview Part 1 | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Copper Bonding Wire 23/Jul/2014 | |
| Standard Package | 30 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | 89LP | |
| Packaging | Tube | |
| Core Processor | 8051 | |
| Core Size | 8-Bit | |
| Speed | 20MHz | |
| Connectivity | SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 14 | |
| Program Memory Size | 2KB (2K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 128 x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.4 V ~ 5.5 V | |
| Data Converters | - | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 16-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 16-DIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AT89LP216-20PU | |
| Related Links | AT89LP2, AT89LP216-20PU Datasheet, Atmel Distributor | |
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