Ship from: HONGKONG
								Date Code: Newest Date Code
								Manufacturer lead time 6 weeks
| Internal Part Number | EIS-ATSAM3N1CB-CU | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Software Framework (ASF) Example of Use Studio Introduction to Software Framework (ASF) Studio Development Environment Overview Part 1 | |
| Design Resources | Development Tool Selector | |
| Standard Package | 260 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | SAM3N | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-M3 | |
| Core Size | 32-Bit | |
| Speed | 48MHz | |
| Connectivity | I²C, IrDA, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT | |
| Number of I/O | 79 | |
| Program Memory Size | 64KB (64K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 8K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.62 V ~ 3.6 V | |
| Data Converters | A/D 16x10b; D/A 1x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 100-TFBGA | |
| Supplier Device Package | 100-TFBGA (9x9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | ATSAM3N1CB-CU | |
| Related Links | ATSAM3, ATSAM3N1CB-CU Datasheet, Atmel Distributor | |
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