Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-ATSAM3S1CB-CUR | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Software Framework (ASF) Example of Use Studio Introduction to Software Framework (ASF) Studio Development Environment Overview Part 1 | |
Design Resources | Development Tool Selector | |
Featured Product | Atmel - SAM3S Series MCUs | |
PCN Packaging | Tape and Reel Label Update 10/Feb/2015 | |
Standard Package | 1 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | SAM3S | |
Packaging | Cut Tape (CT) | |
Core Processor | ARM® Cortex®-M3 | |
Core Size | 32-Bit | |
Speed | 64MHz | |
Connectivity | EBI/EMI, I²C, Memory Card, SPI, SSC, UART/USART, USB | |
Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | |
Number of I/O | 79 | |
Program Memory Size | 64KB (64K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 16K x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.62 V ~ 3.6 V | |
Data Converters | A/D 15x10/12b, D/A 2x12b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 100-TFBGA | |
Supplier Device Package | 100-TFBGA (9x9) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | ATSAM3S1CB-CUR | |
Related Links | ATSAM3S, ATSAM3S1CB-CUR Datasheet, Atmel Distributor |
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