Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-ATXMEGA384D3-MH | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Software Framework (ASF) Example of Use Studio Introduction to Software Framework (ASF) Studio Development Environment Overview Part 1 | |
Design Resources | Development Tool Selector | |
Featured Product | Atmel - AVR® XMEGA® LCD Peripheral | |
PCN Design/Specification | Copper Bonding Wire 17/Oct/2013 | |
PCN Other | MSL Update 26/Feb/2014 | |
Standard Package | 260 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | AVR® XMEGA® D3 | |
Packaging | Tray | |
Core Processor | AVR | |
Core Size | 8/16-Bit | |
Speed | 32MHz | |
Connectivity | I²C, IrDA, SPI, UART/USART | |
Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT | |
Number of I/O | 50 | |
Program Memory Size | 384KB (384K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | 4K x 8 | |
RAM Size | 32K x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.6 V ~ 3.6 V | |
Data Converters | A/D 16x12b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 64-VFQFN Exposed Pad | |
Supplier Device Package | 64-QFN (9x9) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | ATXMEGA384D3-MH | |
Related Links | ATXMEGA, ATXMEGA384D3-MH Datasheet, Atmel Distributor |
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