Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-AX1000-FG676I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Assembly/Origin | Various PGA Pkg Assembly Site Chg 5/Nov/2015 | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Axcelerator | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | 12096 | |
Total RAM Bits | 165888 | |
Number of I/O | 418 | |
Number of Gates | 1000000 | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | AX1000-FG676I | |
Related Links | AX1000, AX1000-FG676I Datasheet, Microsemi SoC Distributor |
![]() | RR0816Q-430-D | RES SMD 43 OHM 0.5% 1/16W 0816 | datasheet.pdf | |
![]() | LD05YA332FAB2A | CAP CER 3300PF 16V NP0 0805 | datasheet.pdf | |
![]() | CB2JB27R0 | RES 27 OHM 2W 5% CERAMIC WW | datasheet.pdf | |
![]() | AC4490-200M-485 | TXRX 900MHZ 3.3-5.5V TTL 200MW | datasheet.pdf | |
![]() | D38999/26FA35PE | CONN PLUG 6POS STRAIGHT W/PINS | datasheet.pdf | |
![]() | 0874380842 | 1.5MM WTB HDR RA SMT 2.54SNLF | datasheet.pdf | |
![]() | MLX90360EGO-ACD-000-RE | IC SENSOR INTERFACE PROG 16TSSOP | datasheet.pdf | |
![]() | FH19C-24S-0.5SH(99) | CONN FFC BOTTOM 24POS 0.50MM R/A | datasheet.pdf | |
![]() | PPT2-0500DWF5VS | PRESSURE TRANSDUCER | datasheet.pdf | |
![]() | ATS-15H-203-C1-R0 | HEATSINK 54X54X10MM XCUT | datasheet.pdf | |
![]() | YG05015100J0G | 500 TB RISING CLAMP 180D | datasheet.pdf | |
![]() | 232-200ABE-23 | HEATSINK TO-220 VERT | datasheet.pdf |