Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-B10-8000-PCB | |
| Lead Free Status / RoHS Status | Request inventory verification / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Prototyping Products | |
| Family | Prototype Boards Perforated | |
| Series | - | |
| Proto Board Type | Breadboard, General Purpose | |
| Plating | - | |
| Pitch | 0.1" (2.54mm) Grid | |
| Circuit Pattern | Pad Per Hole (Round) | |
| Edge Contacts | - | |
| Hole Diameter | - | |
| Size / Dimension | - | |
| Board Thickness | 0.062" (1.57mm) 1/16" | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | B10-8000-PCB | |
| Related Links | B10-80, B10-8000-PCB Datasheet, Twin Industries Distributor | |
![]() | BN-064HSR | MEMORY CARD SRAM 64KB | datasheet.pdf | |
![]() | PBC16DBDN | CONN HEADER .100 DUAL R/A 32POS | datasheet.pdf | |
![]() | 0224.500DRT2P | FUSE GLASS 500MA 250VAC 125VDC | datasheet.pdf | |
| HCPL-2611#320 | OPTOISO 5KV OPEN COLL 8DIP GW | datasheet.pdf | ||
![]() | SA102A820JAC | CAP CER 82PF 200V NP0 AXIAL | datasheet.pdf | |
![]() | MT9HTF12872AZ-80EH1 | MODULE DDR2 SDRAM 1GB 240UDIMM | datasheet.pdf | |
![]() | IXYH75N65C3 | IGBT 650V 170A 750W TO247 | datasheet.pdf | |
![]() | ATS-03C-81-C2-R0 | HEATSINK 30X30X20MM R-TAB T766 | datasheet.pdf | |
![]() | MS17347R20C7S | CONN RCPT 8POS JAM NUT SKT | datasheet.pdf | |
![]() | ATXMEGA128A4U-MN | IC MCU 8BIT 128KB FLASH | datasheet.pdf | |
![]() | 97-3107B28-18SY-417 | AB 12C 12#16 SKT PLUG | datasheet.pdf | |
![]() | XCV600E-6FG680I | Virtex-E 1.8 V FPGA Field Programmable Gate Arrays IC | datasheet.pdf |