Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-BACC63BN16-24S6 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | BACC63BN16-24S6 | |
Related Links | BACC63B, BACC63BN16-24S6 Datasheet, Bel Fuse Inc. Distributor |
![]() | EXQ125-48S1V2-R | CONV DC/DC OPN FRM 1.2V OUT 125W | datasheet.pdf | |
![]() | GBB65DHLR | CONN EDGECARD 130PS .050 DIP SLD | datasheet.pdf | |
![]() | DMM6S22K-F | CAP FILM 0.022UF 10% 630VDC RAD | datasheet.pdf | |
![]() | 2-796748-3 | TERM BLOCK RCPT 23POS R/A 5MM | datasheet.pdf | |
![]() | RWR71S2000FSBSL | RES 200 OHM 2W 1% WW AXIAL | datasheet.pdf | |
![]() | 8N3SV76FC-0170CDI | IC OSC VCXO 100MHZ 6-CLCC | datasheet.pdf | |
![]() | SFH11-PBPC-D30-ST-BK | Connector Header 60 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | ATS-18H-80-C2-R0 | HEATSINK 30X30X15MM R-TAB T766 | datasheet.pdf | |
![]() | 739W-X2/45 | TMPR RES NEMA 5-15R SNP-IN OUTLT | datasheet.pdf | |
![]() | MS27472T16B35PA-LC | JT 55C 55#22D PIN RECP | datasheet.pdf | |
![]() | XC3090-50CB164M | Field Programmable Gate Array, 320 CLBs, 5000 Gates, 50MHz, CMOS, CQFP164 IC | datasheet.pdf | |
![]() | XC4003E-PQ100C | IC FPGA 61 I/O 84PLCC | datasheet.pdf |