Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BACC63BV18F14S9 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BACC63BV18F14S9 | |
| Related Links | BACC63B, BACC63BV18F14S9 Datasheet, Bel Fuse Inc. Distributor | |
![]() | LTC1625CS#PBF | IC REG CTRLR BUCK PWM CM 16-SOIC | datasheet.pdf | |
![]() | RT0402BRD0724K9L | RES SMD 24.9KOHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | ESA35DRSI-S288 | CONN EDGECARD 70POS .125 EXTEND | datasheet.pdf | |
![]() | MAX3490EPA+ | IC TXRX RS485/422 10MBPS 8DIP | datasheet.pdf | |
![]() | 32471C | FIXED IND 470UH 660MA 312 MOHM | datasheet.pdf | |
![]() | NCP5005GEVB | EVAL BOARD FOR NCP5005G | datasheet.pdf | |
![]() | XC7VX690T-3FF1158E | IC FPGA 350 I/O 1158FCBGA | datasheet.pdf | |
![]() | ESR03EZPF3001 | RES SMD 3K OHM 1% 1/4W 0603 | datasheet.pdf | |
![]() | ESR03EZPF5R60 | RES SMD 5.6 OHM 1% 1/4W 0603 | datasheet.pdf | |
![]() | ATS-04H-56-C1-R0 | HEATSINK 35X35X15MM L-TAB | datasheet.pdf | |
![]() | G125-MC11605L4-0300F | 1.25MM M/F 16POS 26AWG 300MM | datasheet.pdf | |
![]() | CTVP00RW-25-43JB-LC | CTV 43C 23#20 20#16 SKT RECP | datasheet.pdf |