Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BAP64LX,315 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 10,000 | |
| Category | Discrete Semiconductor Products | |
| Family | RF Diodes | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Diode Type | PIN - Single | |
| Voltage - Peak Reverse (Max) | 60V | |
| Current - Max | 100mA | |
| Capacitance @ Vr, F | 0.3pF @ 20V, 1MHz | |
| Resistance @ If, F | 1.5 Ohm @ 100mA, 100MHz | |
| Power Dissipation (Max) | 150mW | |
| Package / Case | SOD-882 | |
| Supplier Device Package | SOD2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BAP64LX,315 | |
| Related Links | BAP64, BAP64LX,315 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
![]() | H11A1S | OPTOISO 5KV TRANS W/BASE 6SMD | datasheet.pdf | |
![]() | SLD24U-017 | TVS DIODE 24VWM 38.9VC AXIAL | datasheet.pdf | |
| IRLR014TR | MOSFET N-CH 60V 7.7A DPAK | datasheet.pdf | ||
![]() | TSW-123-06-S-D | CONN HEADER 46POS .100" DL GOLD | datasheet.pdf | |
![]() | 1060840-1 | CONN TNC JACK STR 50 OHM SOLDER | datasheet.pdf | |
![]() | 0239.150MXP | FUSE GLASS 150MA 250VAC 5X20MM | datasheet.pdf | |
![]() | PCI-MT64-XM-UT6 | LICENSE PCI MAST/TARG 64BIT XP | datasheet.pdf | |
![]() | RN55C2843BRE6 | RES 284K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | ATS-09A-171-C1-R0 | HEATSINK 30X30X20MM R-TAB | datasheet.pdf | |
![]() | ATS-04C-154-C1-R0 | HEATSINK 40X40X15MM L-TAB | datasheet.pdf | |
| UPW2D3R3MPD1TA | CAP ALUM 3.3UF 20% 200V RADIAL | datasheet.pdf | ||
![]() | XC4013-3PG223M | IC FPGA 160 I/O 208QFP | datasheet.pdf |