Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BBL-131-G-F | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Board-to-Board Connectors | |
| Featured Product | Board-To-Board Interconnect Systems | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Headers, Male Pins | |
| Series | BBL | |
| Packaging | Bulk | |
| Connector Type | Unshrouded | |
| Number of Positions | 31 | |
| Number of Positions Loaded | All | |
| Pitch | 0.100" (2.54mm) | |
| Number of Rows | 1 | |
| Row Spacing | - | |
| Height Stacking (Mating) | - | |
| Molding Height Above Board | 0.085" (2.16mm) | |
| Contact Mating Length | 0.122" (3.10mm) | |
| Mounting Type | Through Hole | |
| Termination | Solder | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 20µin (0.51µm) | |
| Features | - | |
| Color | Black | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BBL-131-G-F | |
| Related Links | BBL-1, BBL-131-G-F Datasheet, Samtec, Inc. Distributor | |
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