Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BLM6G10-30G,118 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices 29/Dec/2014 | |
| Standard Package | 100 | |
| Category | RF/IF and RFID | |
| Family | RF Amplifiers | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Frequency | 920MHz ~ 960MHz | |
| P1dB | - | |
| Gain | 29dB | |
| Noise Figure | - | |
| RF Type | W-CDMA | |
| Voltage - Supply | 28V | |
| Current - Supply | - | |
| Test Frequency | - | |
| Package / Case | SOT822-1 | |
| Supplier Device Package | 16-HSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BLM6G10-30G,118 | |
| Related Links | BLM6G10, BLM6G10-30G,118 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
![]() | 9T06031A8872DAHFT | RES SMD 88.7KOHM 0.5% 1/10W 0603 | datasheet.pdf | |
![]() | 045036006200862+ | CONN SIM CARD PUSH-PUSH R/A SMD | datasheet.pdf | |
![]() | 241-4-20 | XFRMR LAMINATED 6VA CHAS MOUNT | datasheet.pdf | |
![]() | 165X02629XE | CONN BACKSHELL DB25 STR METAL | datasheet.pdf | |
![]() | LF30CDT | IC REG LDO 3V 0.5A DPAK | datasheet.pdf | |
![]() | 3224G-1-504E | TRIMMER 500K OHM 0.25W SMD | datasheet.pdf | |
![]() | GI810HE3/54 | DIODE GEN PURP 50V 1A DO204AC | datasheet.pdf | |
![]() | 1858196 | CONN HEADER FIB OPT 10POS 5.08MM | datasheet.pdf | |
![]() | C911U220JUNDAAWL45 | CAP CER 22PF 400VAC NP0 RADIAL | datasheet.pdf | |
![]() | MI-J7W-MZ-S | CONVERT DC/DC 165VIN 5.5VOUT 25W | datasheet.pdf | |
![]() | 150392J630BB | CAP FILM 3900PF 5% 630VDC AXIAL | datasheet.pdf | |
![]() | FCC17B25PN2E0 | D-Sub Connector Plug, Male Pins 25 Position Through Hole Solder | datasheet.pdf |