Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-CB3106E18-3P | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | CB3106E18-3P | |
Related Links | CB3106, CB3106E18-3P Datasheet, Amphenol Industrial Distributor |
![]() | 964314-1 | TAB 5,8X0,8 | datasheet.pdf | |
![]() | MSP430G2332IPW20 | IC MCU 16BIT 4KB FLASH 20TSSOP | datasheet.pdf | |
![]() | RN65E2002BB14 | RES 20K OHM 1/2W .1% AXIAL | datasheet.pdf | |
![]() | RL20S301GB14 | RES 300 OHM 1/2W 2% AXIAL | datasheet.pdf | |
![]() | ASCSM-68.000MHZ-LR-T | OSC MEMS 68.000MHZ CMOS SMD | datasheet.pdf | |
![]() | F05E-303146 | CONN FPC VERT 30POS 0.50MM SMD | datasheet.pdf | |
![]() | 1N5754C | DIODE ZENER 56V 500MW DO35 | datasheet.pdf | |
![]() | PHP00805E8870BST1 | RES SMD 887 OHM 0.1% 5/8W 0805 | datasheet.pdf | |
![]() | ATS-06D-132-C2-R0 | HEATSINK 60X60X25MM XCUT T766 | datasheet.pdf | |
![]() | ATS-20D-125-C1-R0 | HEATSINK 54X54X10MM XCUT | datasheet.pdf | |
![]() | 97-3108B28-15P-417-940 | AB 35C 35#16 PIN PLUG | datasheet.pdf | |
![]() | XC2S50-6PQ208I | Spartan-II FPGA Family IC | datasheet.pdf |