Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-CMF701K5000FEEB | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 1,000 | |
Category | Resistors | |
Family | Through Hole Resistors | |
Series | CMF | |
Packaging | Tape & Reel (TR) | |
Resistance (Ohms) | 1.5k | |
Tolerance | ±1% | |
Power (Watts) | 1.75W | |
Composition | Metal Film | |
Features | Flame Retardant Coating, Moisture Resistant, Safety | |
Temperature Coefficient | ±25ppm/°C | |
Operating Temperature | -55°C ~ 175°C | |
Package / Case | Axial | |
Supplier Device Package | Axial | |
Size / Dimension | 0.180" Dia x 0.562" L (4.57mm x 14.27mm) | |
Height | - | |
Number of Terminations | 2 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | CMF701K5000FEEB | |
Related Links | CMF701K, CMF701K5000FEEB Datasheet, Vishay/Dale Distributor |
94738 | TERM RING INSUL 16-14AWG #8 | datasheet.pdf | ||
GCC19DRYN | CONN EDGECARD 38POS DIP .100 SLD | datasheet.pdf | ||
GMC30DRYS-S93 | CONN EDGECARD 60POS DIP .100 SLD | datasheet.pdf | ||
RNC50J5900BSBSL | RES 590 OHM 1/10W .1% AXIAL | datasheet.pdf | ||
CD44S13E4RV12LF | D-Sub Connector Receptacle, Female Sockets 44 Position Through Hole, Right Angle Solder Paste | datasheet.pdf | ||
30434-36 | AC/DC | datasheet.pdf | ||
MDM-100SH002P | MICRO 100 F 12" RBW JACKP | datasheet.pdf | ||
SIT3807AC-C-18NB | OSC MEMS PROG 1.8V SMD | datasheet.pdf | ||
3044207 | UT 16 RD | datasheet.pdf | ||
TVP00RW-19-88P-P3AD | HD 38999 88C 88#23 PIN RECP | datasheet.pdf | ||
TVPS00RK-15-97S-LC | TV 12C 8#20 4#16 SKT RECP | datasheet.pdf | ||
XC4044XL-08HQG208I | IC FPGA 289 I/O 352MBGA | datasheet.pdf |