Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CY7C2165KV18-550BZC | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | QDR II+ and DDR II+ Xtreme line of devices | |
| PCN Assembly/Origin | Qualification of Die Attach Film 13/Dec/2013 Assembly Site Add 08/Oct/2015 | |
| PCN Other | Multiple Updates 27/Mar/2015 | |
| Standard Package | 136 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Synchronous, QDR II+ | |
| Memory Size | 18M (512K x 36) | |
| Speed | 550MHz | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.9 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 165-LBGA | |
| Supplier Device Package | 165-FBGA (13x15) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CY7C2165KV18-550BZC | |
| Related Links | CY7C2165K, CY7C2165KV18-550BZC Datasheet, Cypress Semiconductor Distributor | |
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