Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-CY8C29466-24PXI | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
Featured Product | CapSense Sensing Technology | |
PCN Assembly/Origin | Copper Wire Bonds/Transfer 14/Jun/2013 GSMC Manufacture Merger 15/May/2014 Wafer Test Site Addition 29/Jun/2015 Assembly Site Transfer 14/Sep/2015 | |
PCN Other | Multiple Updates 27/Mar/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 15 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | PSOC®1 CY8C29xxx | |
Packaging | Tube | |
Core Processor | M8C | |
Core Size | 8-Bit | |
Speed | 24MHz | |
Connectivity | I²C, SPI, UART/USART | |
Peripherals | POR, PWM, WDT | |
Number of I/O | 24 | |
Program Memory Size | 32KB (32K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 2K x 8 | |
Voltage - Supply (Vcc/Vdd) | 3 V ~ 5.25 V | |
Data Converters | A/D 4x14b; D/A 4x9b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 28-DIP (0.300", 7.62mm) | |
Supplier Device Package | 28-DIP | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | CY8C29466-24PXI | |
Related Links | CY8C294, CY8C29466-24PXI Datasheet, Cypress Semiconductor Distributor |
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