Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/26KJ29HN-LC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/26KJ29HN-LC | |
| Related Links | D38999/26, D38999/26KJ29HN-LC Datasheet, Amphenol Aerospace Operations Distributor | |
| MU10-4R/SK | CONN RING UNINSUL 12-10 AWG #4 | datasheet.pdf | ||
![]() | 1206YD225KAT2A | CAP CER 2.2UF 16V X5R 1206 | datasheet.pdf | |
![]() | 1008R-221K | FIXED IND 220NH 1.055A 135 MOHM | datasheet.pdf | |
![]() | TNPW1206330KBETA | RES SMD 330K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | RP10-1212SE | CONV DC/DC 10W 9-18VIN 12VOUT | datasheet.pdf | |
![]() | 0634461911 | INSULATION PUNCH | datasheet.pdf | |
![]() | B43601A5337M87 | CAP ALUM 330UF 20% 450V SNAP | datasheet.pdf | |
![]() | 1887214 | Thermal Pad TCF 4000 PXF 0.39" | datasheet.pdf | |
![]() | 6-59591-9 | SLEEVE | datasheet.pdf | |
![]() | MKP385233085JCI2B0 | CAP FILM 0.0033UF 5% 850VDC AXIA | datasheet.pdf | |
![]() | XCV50E-FG256AGT | IC FPGA 180 I/O 256BGA | datasheet.pdf | |
![]() | XC2V1000-3FF896C | IC FPGA 328 I/O 575BGA | datasheet.pdf |