Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/26MJ11BD | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/26MJ11BD | |
| Related Links | D38999/, D38999/26MJ11BD Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | ERJ-S08F5231V | RES SMD 5.23K OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | 108483012002025 | CONNECTOR HEADER 12POS STR | datasheet.pdf | |
![]() | CA3106E18-11SB15 | CONN PLUG 5POS INLINE W/SKTS | datasheet.pdf | |
![]() | V24B12H250BF3 | CONVERTER MOD DC/DC 12V 250W | datasheet.pdf | |
![]() | TWR-PXD10-KIT | PXD10 TOWER MCU KIT | datasheet.pdf | |
![]() | 0230.750DAT1P | FUSE 250V SB PT 2AG WLD LDS .750 | datasheet.pdf | |
![]() | ATS-19A-84-C2-R0 | HEATSINK 30X30X35MM R-TAB T766 | datasheet.pdf | |
![]() | 70156-3395 | SYSTEM | datasheet.pdf | |
![]() | DSPIC33EP32GS502-E/MM | IC DSC 32KB | datasheet.pdf | |
![]() | SIT3808AI-2-18NB | OSC MEMS PROG 1.8V SMD | datasheet.pdf | |
![]() | 0802740 | BLUEMARK MAG EM-M (60X30) | datasheet.pdf | |
![]() | MALREKE00KG315SG0K | 150UF 200V 18X25 | datasheet.pdf |