Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DF17C(3.0)-80DS-0.5V(57) | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,000 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | DF17 | |
| Packaging | Tape & Reel (TR) | |
| Connector Type | Receptacle, Center Strip Contacts | |
| Number of Positions | 80 | |
| Pitch | 0.020" (0.50mm) | |
| Number of Rows | 2 | |
| Mounting Type | Surface Mount | |
| Features | - | |
| Contact Finish | Gold | |
| Contact Finish Thickness | - | |
| Mated Stacking Heights | - | |
| Height Above Board | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DF17C(3.0)-80DS-0.5V(57) | |
| Related Links | DF17C(3.0)-8, DF17C(3.0)-80DS-0.5V(57) Datasheet, Hirose Electric Co Ltd Distributor | |
![]() | RG3216V-4701-B-T1 | RES SMD 4.7K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | GMM36DRMN | CONN EDGECARD 72POS .156 WW | datasheet.pdf | |
![]() | SDUS5EB-008G | USSD 5000 8GB SLC LP | datasheet.pdf | |
![]() | 72605L50PF | IC FIFO BI SYNC 256X18 64-TQFP | datasheet.pdf | |
![]() | 3-6278028-9 | CA 62.5 OFNR MT-RJ TO SC | datasheet.pdf | |
![]() | 4N38S(TA) | OPTOISO 5KV TRANS W/BASE 6SMD | datasheet.pdf | |
![]() | M1AGL250V2-VQ100I | IC FPGA 68 I/O 100VQFP | datasheet.pdf | |
![]() | 21032212405 | CIRCULAR CONN W/HARAX M12 L 4 F | datasheet.pdf | |
![]() | 0746962521 | CONN HEADER 100POS 2MM T/H GOLD | datasheet.pdf | |
![]() | M83723/74R2457Y-LC | CONN HSG RCPT JAM NUT 57POS PIN | datasheet.pdf | |
![]() | 373469 | COMPRESSION SPRING | datasheet.pdf | |
![]() | 696696-1 | AMPOWER,2,3/8,TIN,90,30 DEG BL R | datasheet.pdf |