Maxim Integrated DS34S132GN+

DS34S132GN+ picture photo
Mfg. Part Number
DS34S132GN+
Manufacturer
Product Category
Interface - Telecom
Brief Description
IC TDM OVER PACKET 676-BGA
Datasheet Download
DS34S132GN+.pdf
Availability of DS34S132GN+

Available Quantity

5020 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
N/A
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of DS34S132GN+, we specialize in Maxim Integrated all series electronic components. DS34S132GN+ can be shipped within 24 hours after order. If you have any demands for DS34S132GN+, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
DS34S132GN+ Order Process
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Specifications of DS34S132GN+
Internal Part NumberEIS-DS34S132GN+
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)Obsolete / Discontinued
ConditionNew & Unused, Original Sealed
Product Training ModulesLead (SnPb) Finish for COTS
Long-Term Supply Program
EDA / CAD ModelsDownload from Accelerated Designs
Standard Package1
Category Integrated Circuits (ICs)
FamilyInterface - Telecom
Series-
PackagingTray
FunctionTDM-over-Packet (TDMoP)
InterfaceTDMoP
Number of Circuits1
Voltage - Supply1.8V, 3.3V
Current - Supply-
Power (Watts)-
Operating Temperature-40°C ~ 85°C
Mounting TypeSurface Mount
Package / Case676-BGA
Supplier Device Package676-PBGA (27x27)
Includes-
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)DS34S132GN+
Related LinksDS34S, DS34S132GN+ Datasheet, Maxim Integrated Distributor
DS34S132GN+ Details Description
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