Microchip Technology DSPIC33EP256GM306-H/MR
- Mfg. Part Number
- DSPIC33EP256GM306-H/MR
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC DSC 16BIT 256KB FLASH 64QFN
- Datasheet Download
- DSPIC33EP256GM306-H/MR.pdf
Availability of DSPIC33EP256GM306-H/MR
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 6.22000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of DSPIC33EP256GM306-H/MR, we specialize in Microchip Technology all series electronic components. DSPIC33EP256GM306-H/MR can be shipped within 24 hours after order. If you have any demands for DSPIC33EP256GM306-H/MR, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- DSPIC33EP256GM306-H/MR Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
DSPIC33EP256GM306-H/MR
| Internal Part Number | EIS-DSPIC33EP256GM306-H/MR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Featured Product | Dual Motor Control Made Easy with dsPIC33E DSCs | |
| PCN Design/Specification | DSPIC33EPyyyGM3xx/6xx/7xx Errata 25/Jun/2013 Datasheet Revision 02/Oct/2013 Errata Document Revision 02/Oct/2013 DSPIC33EPyyyGM3,6,7 Errata Update 28/Oct/2013 Multiple Devices Errata Update 27/Nov/2013 Errata/Datasheet Update 08/Jul/2014 DSPIC33EPY Datasheet Update 14/Aug/2014 Errata/Datasheet Update 10/Oct/2014 Mold Compound Update 31/Oct/2014 Errata/Datasheet Update 06/Jan/2015 Errata/Datasheet Update 16/Jun/2015 Errata Update 22/Sep/2015 dsPIC33EPXXXGM3XX/6XX/7XX Errata Doc Rev 08/Oct/2015 | |
| PCN Assembly/Origin | Assembly Site Addition 22/Jun/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 33EP | |
| Packaging | Tube | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | - | |
| Connectivity | I²C, IrDA, LIN, QEI, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | |
| Number of I/O | 53 | |
| Program Memory Size | 256KB (85.5K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 32K x 8 | |
| Voltage - Supply (Vcc/Vdd) | - | |
| Data Converters | A/D 30x10b/12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 150°C | |
| Package / Case | 64-VFQFN Exposed Pad | |
| Supplier Device Package | 64-QFN Exposed Pad (9x9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC33EP256GM306-H/MR | |
| Related Links | DSPIC33EP25, DSPIC33EP256GM306-H/MR Datasheet, Microchip Technology Distributor | |
DSPIC33EP256GM306-H/MR Details Description
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