Microchip Technology DSPIC33FJ09GS302T-E/MX
- Mfg. Part Number
- DSPIC33FJ09GS302T-E/MX
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC DSC 16BIT 9KB FLASH 28QFN
- Datasheet Download
- DSPIC33FJ09GS302T-E/MX.pdf
Availability of DSPIC33FJ09GS302T-E/MX
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 2.87001
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of DSPIC33FJ09GS302T-E/MX, we specialize in Microchip Technology all series electronic components. DSPIC33FJ09GS302T-E/MX can be shipped within 24 hours after order. If you have any demands for DSPIC33FJ09GS302T-E/MX, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- DSPIC33FJ09GS302T-E/MX Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
DSPIC33FJ09GS302T-E/MX
| Internal Part Number | EIS-DSPIC33FJ09GS302T-E/MX | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Interleaved Power Factor Correction Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Mold Compound Update 31/Oct/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 3,300 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 33F | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 40 MIPs | |
| Connectivity | I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 21 | |
| Program Memory Size | 9KB (3K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 1K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 8x10b, D/A 2x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 28-VQFN Exposed Pad | |
| Supplier Device Package | 28-QFN-S (6x6) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC33FJ09GS302T-E/MX | |
| Related Links | DSPIC33FJ09, DSPIC33FJ09GS302T-E/MX Datasheet, Microchip Technology Distributor | |
DSPIC33FJ09GS302T-E/MX Details Description
Related parts for DSPIC33FJ09GS302T-E/MX
 | NC7WB66K8X | IC SWITCH DUAL SPST-NO US8 | datasheet.pdf | |
 | CRCW251210R7FKEG | RES SMD 10.7 OHM 1% 1W 2512 | datasheet.pdf | |
 | 1812PC222KAT1A | CAP CER 2200PF 250V X7R 1812 | datasheet.pdf | |
 | MS3456W22-14SW | CONN PLUG 19POS STRAIGHT W/SCKT | datasheet.pdf | |
 | SA12C-E3/54 | TVS DIODE 12VWM 22VC DO204AC | datasheet.pdf | |
 | MBRB10H60-E3/45 | DIODE SCHOTTKY 60V 10A TO263AB | datasheet.pdf | |
 | NOJT476M002RWJ | CAP NIOB OXID 47UF 20% 2.5V 1210 | datasheet.pdf | |
 | RN50C1820FRSL | RES 182 OHM 1/20W 1% AXIAL | datasheet.pdf | |
.jpg) | 600S3R6AT250XT | CAP CER 3.6PF 250V NP0 0603 | datasheet.pdf | |
| RBB105DYFR | CONN EDGECARD .050" 105POS SMD | datasheet.pdf | |
 | YMC19SAAN | HI-TEMP CONN HDR .100 SNGL 19POS | datasheet.pdf | |
| M2GL010-VF256I | IC FPGA 233 I/O 256VF | datasheet.pdf |