Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DSPIC33FJ09GS302T-I/TL | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Interleaved Power Factor Correction Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Errata and Datasheet Update 01/Oct/2013 Errata/Datasheet Update 13/Oct/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 3,300 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 33F | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 40 MIPs | |
| Connectivity | I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 21 | |
| Program Memory Size | 9KB (3K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 1K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 8x10b, D/A 2x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 36-VFTLA Exposed Pad | |
| Supplier Device Package | 36-VTLA (5x5) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC33FJ09GS302T-I/TL | |
| Related Links | DSPIC33FJ09, DSPIC33FJ09GS302T-I/TL Datasheet, Microchip Technology Distributor | |
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