Microchip Technology DSPIC33FJ32GS606-E/MR

DSPIC33FJ32GS606-E/MR picture photo
Mfg. Part Number
DSPIC33FJ32GS606-E/MR
Manufacturer
Product Category
Embedded - Microcontrollers
Brief Description
IC DSC 16BIT 32KB FLASH 64QFN
Datasheet Download
DSPIC33FJ32GS606-E/MR.pdf
Availability of DSPIC33FJ32GS606-E/MR

Available Quantity

5020 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 4.31000
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of DSPIC33FJ32GS606-E/MR, we specialize in Microchip Technology all series electronic components. DSPIC33FJ32GS606-E/MR can be shipped within 24 hours after order. If you have any demands for DSPIC33FJ32GS606-E/MR, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
DSPIC33FJ32GS606-E/MR Order Process
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Specifications of DSPIC33FJ32GS606-E/MR
Internal Part NumberEIS-DSPIC33FJ32GS606-E/MR
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Product Training ModulesInterleaved Power Factor Correction
Bluetooth Audio Development Platform
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationDSPIC33FJyyGS Datasheet Update 17/Jul/2014
Errata Update 22/Oct/2014
Mold Compound Update 31/Oct/2014
Errata/Datasheet Update 28/Jan/2015
PCN Assembly/OriginAssembly Site Addition 22/Jun/2015
PCN PackagingLabel and Packing Changes 23/Sep/2015
Standard Package40
Category Integrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
SeriesdsPIC™ 33F
PackagingTube
Core ProcessordsPIC
Core Size16-Bit
Speed40 MIPs
ConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, QEI, POR, PWM, WDT
Number of I/O58
Program Memory Size32KB (32K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size4K x 8
Voltage - Supply (Vcc/Vdd)3 V ~ 3.6 V
Data ConvertersA/D 16x10b; D/A 1x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 125°C
Package / Case64-VFQFN Exposed Pad
Supplier Device Package64-QFN Exposed Pad (9x9)
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)DSPIC33FJ32GS606-E/MR
Related LinksDSPIC33FJ3, DSPIC33FJ32GS606-E/MR Datasheet, Microchip Technology Distributor
DSPIC33FJ32GS606-E/MR Details Description
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