Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EFM32G890F64-BGA112 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Featured Product | Internet of Things | |
| Standard Package | 1,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | Gecko | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | ARM® Cortex®-M3 | |
| Core Size | 32-Bit | |
| Speed | 32MHz | |
| Connectivity | EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | |
| Number of I/O | 90 | |
| Program Memory Size | 64KB (64K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 16K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.85 V ~ 3.8 V | |
| Data Converters | A/D 8x12b, D/A 2x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 112-LFBGA | |
| Supplier Device Package | 112-BGA (10x10) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EFM32G890F64-BGA112 | |
| Related Links | EFM32G890, EFM32G890F64-BGA112 Datasheet, Silicon Labs Distributor | |
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