Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EPF10K30EFC484-2X | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | FLEX-10KE® | |
| Number of LABs/CLBs | 216 | |
| Number of Logic Elements/Cells | 1728 | |
| Total RAM Bits | 24576 | |
| Number of I/O | 220 | |
| Number of Gates | 119000 | |
| Voltage - Supply | 2.375 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 484-BBGA | |
| Supplier Device Package | 484-FBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EPF10K30EFC484-2X | |
| Related Links | EPF10K30, EPF10K30EFC484-2X Datasheet, Alt Distributor | |
![]() | ERJ-S02F3652X | RES SMD 36.5K OHM 1% 1/10W 0402 | datasheet.pdf | |
![]() | GCM22DRSD-S664 | CONN EDGECARD 44POS DIP .156 SLD | datasheet.pdf | |
![]() | MC74LVX50D | IC BUFFER HEX NON-INVERT 14SOIC | datasheet.pdf | |
![]() | ERJ-T08J104V | RES SMD 100K OHM 5% 1/3W 1206 | datasheet.pdf | |
![]() | TXR54AB00-1208AI | CONN BACKSHELL ADPT SZ7-12S OLIV | datasheet.pdf | |
![]() | VI-J4R-IZ-B1 | CONVERTER MOD DC/DC 7.5V 25W | datasheet.pdf | |
![]() | RNC50H2211FMB14 | RES 2.21K OHM 1/10W 1% AXIAL | datasheet.pdf | |
![]() | 30KPA36C-B | TVS DIODE 36VWM 64.89VC P600 | datasheet.pdf | |
![]() | DSPIC33EP512GM604-H/PT | IC DSC 16BIT 512KB FLASH 44TQFP | datasheet.pdf | |
![]() | PPT2-0100AKN5VS | PRESSURE TRANSDUCER | datasheet.pdf | |
![]() | 1407623 | CONN BASE SIDE ENTRY SZB6 M32 | datasheet.pdf | |
![]() | ERA-8ARW1621V | RES SMD 1.62KOHM 0.05% 1/4W 1206 | datasheet.pdf |