Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-FI-TD50SB-E | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | Multiple Devices 11/Apr/2014 | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Rectangular Connectors - Headers, Receptacles, Female Sockets | |
Series | FI-D | |
Packaging | Bulk | |
Connector Type | Receptacle | |
Contact Type | Female Socket | |
Number of Positions | 50 | |
Number of Positions Loaded | All | |
Pitch | 0.050" (1.27mm) | |
Number of Rows | 1 | |
Row Spacing | - | |
Mounting Type | Surface Mount | |
Termination | Solder | |
Fastening Type | - | |
Features | Board Guide | |
Contact Finish | Gold | |
Contact Finish Thickness | 30µin (0.76µm) | |
Color | Black | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | FI-TD50SB-E | |
Related Links | FI-TD, FI-TD50SB-E Datasheet, JAE Electronics Distributor |
![]() | RN55C4871FRE6 | RES 4.87K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 83904AGI-02LFT | IC CLK BUFFER 3:4 200MHZ 16TSSOP | datasheet.pdf | |
![]() | 6-1879670-8 | RES 61.9K OHM 1/2W 0.1% AXIAL | datasheet.pdf | |
![]() | PG3RAL | GRILL REPLACEMENT BEIGE | datasheet.pdf | |
![]() | 0752354249 | CONN HEADER BACKPLAN 200POS GOLD | datasheet.pdf | |
![]() | 1168 | RFSB,PSA,SH | datasheet.pdf | |
![]() | EBC08DCKS | CONN EDGECARD 16POS .100" | datasheet.pdf | |
![]() | LTC2323IUFD-16#TRPBF | IC ADC 16BIT 5MSPS 28-QFN | datasheet.pdf | |
![]() | DSC1101BM2-025.0000 | OSC MEMS 25.000MHZ CMOS SMD | datasheet.pdf | |
![]() | GTS030R24-27P | GT 7C 7#16 PIN RECP WALL | datasheet.pdf | |
![]() | XCV100-6BGG256I | IC FPGA 404 I/O 560MBGA | datasheet.pdf | |
![]() | SFU450C19 | Capacitors Inductors Filters... | datasheet.pdf |