Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-H200X084H4T | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Cables, Wires - Management | |
| Family | Labels, Labeling | |
| Series | - | |
| Packaging | 500 per Roll | |
| Label Type | Heat Shrinkable | |
| Label Size | 2.00" x 0.84" (50.8mm x 21.3mm) | |
| Color | Red | |
| Material | Polyolefin | |
| For Use With/Related Products | Thermal Transfer Printer | |
| Operating Temperature | -55°C ~ 135°C | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | H200X084H4T | |
| Related Links | H200X, H200X084H4T Datasheet, Panduit Distributor | |
![]() | ISL6410IU-TK | IC REG BCK PROG 0.6A SYNC 10MSOP | datasheet.pdf | |
![]() | 345-020-541-204 | CARDEDGE 20POS DUAL .100 GREEN | datasheet.pdf | |
![]() | AMM24DRYI | CONN EDGECARD 48POS DIP .156 SLD | datasheet.pdf | |
![]() | PCA9555PWE4 | IC I/O EXPANDER I2C 16B 24TSSOP | datasheet.pdf | |
![]() | 4-1879662-3 | RES 27.4 OHM 1/4W 0.1% AXIAL | datasheet.pdf | |
![]() | RCL0612261RFKEA | RES SMD 261 OHM 1/2W 1206 WIDE | datasheet.pdf | |
![]() | M3272 SL002 | CABLE 2COND 20AWG SHLD 500' | datasheet.pdf | |
![]() | 558-10-400M20-000104 | BGA SURFACE MOUNT 1.27MM | datasheet.pdf | |
![]() | 1812R-823F | FIXED IND 82UH 169MA 7 OHM SMD | datasheet.pdf | |
![]() | 1704356 | HEADER | datasheet.pdf | |
![]() | ATS-18F-174-C3-R0 | HEATSINK 30X30X35MM R-TAB T412 | datasheet.pdf | |
![]() | 1407705 | HC-B24-SG-RBK | datasheet.pdf |