Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-H2F2.36BK | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Cables, Wires - Management | |
Family | Heat Shrink Fabric | |
Series | Shrinkflex | |
Shrinkage Ratio | 2 to 1 | |
Length | 100.0' (30.5m) | |
Diameter - Inner, Recovered | 1.18" (30.0mm) | |
Diameter - Inner, Supplied | 2.36" (60.0mm) | |
Wall Thickness - Nonrecovered | - | |
Color | Black | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | H2F2.36BK | |
Related Links | H2F2, H2F2.36BK Datasheet, Techflex Distributor |
![]() | TNPW251210K0BEEY | RES SMD 10K OHM 0.1% 1/2W 2512 | datasheet.pdf | |
![]() | TNPW06032K40BETA | RES SMD 2.4K OHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | BY500-800-E3/73 | DIODE GEN PURP 800V 5A DO201AD | datasheet.pdf | |
![]() | MDM-51PH002B | MICRO 51POS PIN 12" | datasheet.pdf | |
![]() | CGA4J3X7R1E225K125AB | CAP CER 2.2UF 25V X7R 0805 | datasheet.pdf | |
![]() | A3PN020-2QNG68I | IC FPGA 49 I/O 68QFN | datasheet.pdf | |
![]() | M55342E06B1B05RTF | RES SMD 1.05KOHM 0.1% 0.15W 0805 | datasheet.pdf | |
![]() | V300A8C300BN2 | CONVERTER MOD DC/DC 8V 300W | datasheet.pdf | |
![]() | SIT3809AC-D-28NZ | OSC MEMS PROG 2.8V SMD | datasheet.pdf | |
![]() | TX54AA00-2014 | CONN BACKSHELL ADPT SZ20 37 OLIV | datasheet.pdf | |
![]() | MKP385330160JII2B0 | CAP FILM 0.03UF 5% 1600VDC AXIAL | datasheet.pdf | |
![]() | MB85R4M2TFN-G-ASE1 | IC FRAM 4MBIT 150NS 44TSOP | datasheet.pdf |