Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HC1000-0.020-02-0404 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Thermal Interface Materials (TIM) Gap Pad Key Product Characteristics | |
| RoHS Information | Gap Pad HC1000 Material Report | |
| Standard Package | 100 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Gap Pad® HC1000 | |
| Usage | - | |
| Shape | Square | |
| Outline | 101.60mm x 101.60mm | |
| Thickness | 0.020" (0.508mm) | |
| Material | Polymer | |
| Adhesive | Tacky - Both Sides | |
| Backing, Carrier | Fiberglass | |
| Color | Gray | |
| Thermal Resistivity | - | |
| Thermal Conductivity | 1.0 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HC1000-0.020-02-0404 | |
| Related Links | HC1000-0.0, HC1000-0.020-02-0404 Datasheet, Bergquist Distributor | |
![]() | CP00051R200JB14 | RES 1.2 OHM 5% 5W WIREWOUND AXL | datasheet.pdf | |
| LM317LCPWRG4 | IC REG LDO ADJ 0.1A 8TSSOP | datasheet.pdf | ||
![]() | AFK336M10C12T-F | CAP ALUM 33UF 20% 10V SMD | datasheet.pdf | |
![]() | ADUM7442CRQZ-RL7 | DGTL ISO 1KV 4CH GEN PURP 16QSOP | datasheet.pdf | |
![]() | TNPU08052K43AZEN00 | RES SMD 2.43KOHM 0.05% 1/8W 0805 | datasheet.pdf | |
![]() | SQ48T08060-NBA0 | DC/DC CONVERTER 6V 48W | datasheet.pdf | |
![]() | C1005JB1H104M050BB | CAP CER 0.1UF 50V JB 0402 | datasheet.pdf | |
![]() | 28-3553-18 | CONN IC DIP SOCKET ZIF 28POS | datasheet.pdf | |
![]() | ATS-18D-88-C2-R0 | HEATSINK 35X35X25MM R-TAB T766 | datasheet.pdf | |
![]() | RCL040612R1FKEA | RES SMD 12.1 OHM 1/4W 0604 WIDE | datasheet.pdf | |
![]() | R5F51137ADFP#30 | IC MCU 32BIT FLASH | datasheet.pdf | |
![]() | BFC247990213 | CAP FILM 33NF 5% 630VDC RAD | datasheet.pdf |