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Renesas Electronics America HD64F3052BFI25

HD64F3052BFI25 picture photo
Mfg. Part Number
HD64F3052BFI25
Manufacturer
Product Category
Embedded - Microcontrollers
Brief Description
IC MCU 16BIT 512KB FLASH 100QFP
Datasheet Download
HD64F3052BFI25.pdf
Availability of HD64F3052BFI25

Available Quantity

5020 Pieces

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Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

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EIS Components is the stocking Distributor of HD64F3052BFI25, we specialize in Renesas Electronics America all series electronic components. HD64F3052BFI25 can be shipped within 24 hours after order. If you have any demands for HD64F3052BFI25, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
HD64F3052BFI25 Order Process
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Specifications of HD64F3052BFI25
Internal Part NumberEIS-HD64F3052BFI25
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)Obsolete / Discontinued
ConditionNew & Unused, Original Sealed
Design ResourcesDevelopment Tool Selector
Standard Package1
Category Integrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
SeriesH8® H8/300H
PackagingTray
Core ProcessorH8/300H
Core Size16-Bit
Speed25MHz
ConnectivitySCI, SmartCard
PeripheralsDMA, POR, PWM, WDT
Number of I/O70
Program Memory Size512KB (512K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size8K x 8
Voltage - Supply (Vcc/Vdd)4.5 V ~ 5.5 V
Data ConvertersA/D 8x10b; D/A 2x8b
Oscillator TypeInternal
Operating Temperature-20°C ~ 75°C
Package / Case100-BFQFP
Supplier Device Package100-QFP (14x14)
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)HD64F3052BFI25
Related LinksHD64F30, HD64F3052BFI25 Datasheet, Renesas Electronics America Distributor
HD64F3052BFI25 Details Description
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