Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HDAF-23-18.0-S-13-2 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | HD Mezz™ HDAF | |
| Packaging | Tray | |
| Connector Type | High Density Array, Female | |
| Number of Positions | 299 | |
| Pitch | 0.047" (1.20mm) | |
| Number of Rows | 13 | |
| Mounting Type | Surface Mount | |
| Features | Board Guide | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Mated Stacking Heights | 30mm, 35mm | |
| Height Above Board | 0.807" (20.51mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HDAF-23-18.0-S-13-2 | |
| Related Links | HDAF-23-1, HDAF-23-18.0-S-13-2 Datasheet, Samtec, Inc. Distributor | |
![]() | CTX50-2A-R | INDUCT ARRAY 2 COIL 49.38UH SMD | datasheet.pdf | |
![]() | SN74AUC2G08DCTRG4 | IC GATE AND 2CH 2-INP SM8 | datasheet.pdf | |
![]() | R0E00030AKCT00 | DEV EMULATOR E30A OCD | datasheet.pdf | |
![]() | 0810431303 | CAP MINI PANEL INDICATOR RED | datasheet.pdf | |
![]() | 111-202CAD-B01 | THERMISTOR GLASS BEAD AXIAL | datasheet.pdf | |
![]() | CCK26-36-05 | CARD CAGE KIT 7.4WX8.5" 3U | datasheet.pdf | |
![]() | PIC18F87K90T-I/PT | IC MCU 8BIT 128KB FLASH 80TQFP | datasheet.pdf | |
![]() | 0495180390 | 3.96 W/B CONN. TPA-3P | datasheet.pdf | |
![]() | XBP24-BUIT-001J | XBEE PRO ZNET 2.5 SER2 10MW U.FL | datasheet.pdf | |
![]() | TNM3-6.5-65-1 | ROUND STANDOFF M3 NYLON 65MM | datasheet.pdf | |
![]() | MSP-TS430RGZ48B | BOARD TARGET MSP430F434X | datasheet.pdf | |
![]() | CN1021A18G31S7Y040 | 26500 31C 31#20 S BY RECP LC | datasheet.pdf |