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FFF HM13708000J0G

HM13708000J0G picture photo
Mfg. Part Number
HM13708000J0G
Manufacturer
Product Category
Terminal Blocks - Wire to Board
Brief Description
500 TB SP CLA DIP SOLDER
Datasheet Download
HM13708000J0G.pdf
Availability of HM13708000J0G

Available Quantity

5020 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 1.74200
Our Price
Quote by Email

QUANTITY

 

EIS Components is the stocking Distributor of HM13708000J0G, we specialize in FFF all series electronic components. HM13708000J0G can be shipped within 24 hours after order. If you have any demands for HM13708000J0G, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
HM13708000J0G Order Process
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Specifications of HM13708000J0G
Internal Part NumberEIS-HM13708000J0G
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Standard Package2,030
Category Connectors, Interconnects
FamilyTerminal Blocks - Wire to Board
SeriesHM
PackagingBulk
Number of Levels1
Positions Per Level13
Pitch0.197" (5.00mm)
Mating OrientationVertical with Board
Current8A
Voltage250V
Wire Gauge12-28 AWG
Mounting TypeThrough Hole
Wire TerminationScrewless - Leg Spring, Push-In Spring
FeaturesInterlocking (Side)
ColorGray
Operating Temperature-40°C ~ 115°C
Housing MaterialThermoplastic
Contact Material - PlatingBrass - Tin Plated
Clamp Material - PlatingSteel, Stainless
Screw Material - Plating-
Torque - Screw-
Screw Thread-
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)HM13708000J0G
Related LinksHM1370, HM13708000J0G Datasheet, FFF Distributor
HM13708000J0G Details Description
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