Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-HM2P08PDS2T1N9 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | Millipacs Header & Receptacle 13/Feb/2014 | |
PCN Design/Specification | HM2P, HM2J Plating 20/Oct/2011 HM2 Plating 20/Sept/2012 HM2 Series Copper Alloy 22/Jun/2013 | |
PCN Packaging | Millipacs UL/CSA marking 01/July/2009 Millipacs Devices 16/Dec/2010 | |
Standard Package | 48 | |
Category | Connectors, Interconnects | |
Family | Backplane Connectors - Hard Metric, Standard | |
Series | Millipacs® | |
Packaging | Tray | |
Connector Type | Header, Male Pins | |
Connector Style | B 25 | |
Number of Positions | 175 (125 + 50 Ground) | |
Number of Positions Loaded | All | |
Pitch | 0.079" (2.00mm) | |
Number of Rows | 5 + 2 | |
Mounting Type | Through Hole | |
Termination | Press-Fit | |
Connector Usage | CompactPCI | |
Contact Finish | Gold | |
Contact Finish Thickness | Flash | |
Current Rating | 1.5A | |
Voltage Rating | 750V | |
Operating Temperature | -55°C ~ 125°C | |
Features | - | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | HM2P08PDS2T1N9 | |
Related Links | HM2P08P, HM2P08PDS2T1N9 Datasheet, FFF Distributor |
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