Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-IS42S32200E-6BI | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 240 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SDRAM | |
| Memory Size | 64M (2M x 32) | |
| Speed | 166MHz | |
| Interface | Parallel | |
| Voltage - Supply | 3 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 90-TFBGA | |
| Supplier Device Package | 90-TFBGA (8x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | IS42S32200E-6BI | |
| Related Links | IS42S32, IS42S32200E-6BI Datasheet, ISSI, Integrated Silicon Solution Inc Distributor | |
![]() | 1210CA221JAT1A | CAP CER 220PF 630V NP0 1210 | datasheet.pdf | |
![]() | HFA1105IBZ | IC OPAMP CFA 330MHZ LP 8-SOIC | datasheet.pdf | |
![]() | TXR41AB00-2014BI | CONN BACKSHELL ADPT SZ20 21 OLIV | datasheet.pdf | |
![]() | H2F3.15BK25 | 2:1 FAB HEATSHRINK BLK 80MM 25' | datasheet.pdf | |
![]() | RNC60H2102BSBSL | RES 21K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | RN55E5230BBSL | RES 523 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | 8532-47K | FIXED IND 6.8MH 150MA 15 OHM SMD | datasheet.pdf | |
![]() | ECC30DCBH | CONN EDGECARD 60POS .100" | datasheet.pdf | |
![]() | ATS-11B-204-C1-R0 | HEATSINK 54X54X12MM XCUT | datasheet.pdf | |
![]() | BZX384C9V1-E3-08 | DIODE ZENER 9.1V 200MW SOD323 | datasheet.pdf | |
![]() | 5KP18CA-HR | TVS DIODE 18VWM 29.2VC AXIAL | datasheet.pdf | |
![]() | AIBC6FA28-16SC-025 | ACB 20C 20#16 SKT PLUG | datasheet.pdf |