Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LFSCM3GA25EP1-6F900I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Tin/Lead Devices 23/Jun/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 27 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | SCM | |
| Number of LABs/CLBs | 6250 | |
| Number of Logic Elements/Cells | 25000 | |
| Total RAM Bits | 1966080 | |
| Number of I/O | 378 | |
| Number of Gates | - | |
| Voltage - Supply | 0.95 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 105°C | |
| Package / Case | 900-BBGA | |
| Supplier Device Package | 900-FPBGA (31x31) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LFSCM3GA25EP1-6F900I | |
| Related Links | LFSCM3GA25, LFSCM3GA25EP1-6F900I Datasheet, Lattice Semiconductor Corporation Distributor | |
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