Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-LM3S6637-IBZ50-A2 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Intro to Timers and Clocks Microcontrollers: SYS/BIOS: Introduction to Real-Time Operating Systems and SYS/BIOS | |
Design Resources | Development Tool Selector | |
Manufacturer Product Page | LM3S6637-IBZ50-A2 Specifications | |
Standard Package | 184 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | Stellaris® ARM® Cortex®-M3S 6000 | |
Packaging | Tray | |
Core Processor | ARM® Cortex®-M3 | |
Core Size | 32-Bit | |
Speed | 50MHz | |
Connectivity | Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART | |
Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
Number of I/O | 41 | |
Program Memory Size | 128KB (128K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 32K x 8 | |
Voltage - Supply (Vcc/Vdd) | 2.25 V ~ 2.75 V | |
Data Converters | A/D 4x10b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 108-LFBGA | |
Supplier Device Package | 108-BGA (10x10) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | LM3S6637-IBZ50-A2 | |
Related Links | LM3S6637, LM3S6637-IBZ50-A2 Datasheet, Texas Instruments Distributor |
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