Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-LT1719IS8 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 100 | |
Category | Integrated Circuits (ICs) | |
Family | Linear - Comparators | |
Series | UltraFast™ | |
Packaging | Tube | |
Type | General Purpose | |
Number of Elements | 1 | |
Output Type | CMOS, Rail-to-Rail, TTL | |
Voltage - Supply, Single/Dual (±) | 2.7 V ~ 6 V | |
Voltage - Input Offset (Max) | 2.5mV @ ±5V | |
Current - Input Bias (Max) | 6µA @ ±5V | |
Current - Output (Typ) | 20mA | |
Current - Quiescent (Max) | 9mA | |
CMRR, PSRR (Typ) | 70dB CMRR, 80dB PSRR | |
Propagation Delay (Max) | 13ns | |
Hysteresis | 7mV | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
Mounting Type | Surface Mount | |
Supplier Device Package | 8-SOIC | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | LT1719IS8 | |
Related Links | LT17, LT1719IS8 Datasheet, Linear Distributor |
![]() | TS80C31X2-MCA | IC MCU 8BIT ROMLESS 40DIP | datasheet.pdf | |
![]() | TPS76827QD | IC REG LDO 2.7V 1A 8SOIC | datasheet.pdf | |
![]() | TSW-104-23-L-D | CONN HEADER 8POS .100" DUAL GOLD | datasheet.pdf | |
![]() | 3SBH1139A2 | RELAY GEN PURPOSE 4PDT 2A 26.5V | datasheet.pdf | |
![]() | GBC13DRXS-S734 | CONN EDGECARD 26POS DIP .100 SLD | datasheet.pdf | |
![]() | 350714-4 | CONN HEADER MATE-N-LOK 15CIRCUIT | datasheet.pdf | |
![]() | RY-0515D | CONV DC/DC 1W DL +/-15V OUT SIP7 | datasheet.pdf | |
![]() | 0634540112 | INSULATION PUNCH | datasheet.pdf | |
![]() | COP8CCR9HVA8 | IC MCU 8BIT 32KB FLASH 44PLCC | datasheet.pdf | |
![]() | 95182-412HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | 95-850-158-006 | HD-BNC TO BNC STRT PLUG 6" | datasheet.pdf | |
![]() | EP7311-IV-C | HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf |